Soitec

[Class - 40]

Treatment of materials, namely mechanical, physical and chemical treatment and machining, gluing of material surfaces; treatment of substrates for micro-electronics, opto-electronics and micro-engineering, photovoltaics, microsystems and radio frequency (RF) components and all derived activities; treatment of semiconductor wafers and semiconductors; polishing of semiconductor wafers, transfer of layers of materials, semiconductors or components on all media; treatment of silicon wafers and semiconductors; polishing of silicon wafers and semiconductors, transfer of silicon layers, semiconductors or components on all media.