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6327774

Mar 01, 2024

NESTEN A BOND BEYOND

NESTEN A BOND BEYOND is a DEVICE Trademark filed on Mar 01, 2024 in TAMIL NADU through India IP Office.The Trademark is registered to M.LOHANATHAN and was filed by A.DEVI[37573].

NESTEN A BOND BEYOND Trademark Information

Application ID

6327774

Status

Accepted & Advertised

Date of Application

Mar 01, 2024

Classes

25

Proprietor(s)

M.LOHANATHAN

Attorney

A.DEVI[37573]
No.41,2nd Floor, Swetha Swarnam Complex, Ponnan Kinaru Street, Villivakkam, Chennai - 600049, Tamil Nadu.

Type

DEVICE

Registration State

TAMIL NADU

Country

India

Published

Apr 08, 2024

IP Office

CHENNAI

Used Since

Proposed to be used

FAQ's for NESTEN A BOND BEYOND Trademark

The application for NESTEN A BOND BEYOND was made on Mar 01, 2024
The trademark applicant for NESTEN A BOND BEYOND is M.LOHANATHAN.
Trademark application has been filed under the class(es) 25.
As per IP India, trademark application is on the following stage: Accepted & Advertised.
Listed application Id of NESTEN A BOND BEYOND is 6327774.
Trademark attorney of the NESTEN A BOND BEYOND is A.DEVI[37573].
NESTEN A BOND BEYOND Trademark is a DEVICE mark.
Disclaimer: Vakilsearch assumes no responsibility or liability for any errors or omissions in the content of this page. The data is derived from mca.gov.in and ipindia.gov.in
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