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1150387

Nov 13, 2002

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HI-TECH-BOND

HI-TECH-BOND is a Trademark filed on Nov 13, 2002 in through IP Office.The Trademark is registered to AJAY PASSI. and was filed by attorney.

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HI-TECH-BOND Trademark Information

Application ID

1150387

Status

Abandoned

Date of Application

Nov 13, 2002

Classes

1

Proprietor(s)

AJAY PASSI.

Published

Apr 01, 2006

Used Since

01/04/2001

FAQ's for HI-TECH-BOND Trademark

The application for HI-TECH-BOND was made on Nov 13, 2002
The trademark applicant for HI-TECH-BOND is AJAY PASSI..
Trademark application has been filed under the class(es) 1.
As per IP India, trademark application is on the following stage: Abandoned.
Listed application Id of HI-TECH-BOND is 1150387.
HI-TECH-BOND Trademark is a undefined mark.
Disclaimer: Vakilsearch assumes no responsibility or liability for any errors or omissions in the content of this page. The data is derived from mca.gov.in and ipindia.gov.in
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