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HI-BOND MAHENDRA DAYABHAI RANGPARIYA
HI-BOND is a Trademark filed on Aug 13, 2015 in through IP Office.The Trademark is registered to MAHENDRA DAYABHAI RANGPARIYA and was filed by attorney.
HI-BOND MAHENDRA DAYABHAI RANGPARIYA Trademark Information
Application ID
3031560
Status
Objected
Date of Application
Aug 13, 2015
Classes
1
Proprietor(s)
MAHENDRA DAYABHAI RANGPARIYA
Used Since
01/07/2015
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DEVICE
MAHARASHTRA
FAQ's for HI-BOND MAHENDRA DAYABHAI RANGPARIYA Trademark
The application for HI-BOND was made on Aug 13, 2015
The trademark applicant for HI-BOND is MAHENDRA DAYABHAI RANGPARIYA.
Trademark application has been filed under the class(es) 1.
As per IP India, trademark application is on the following stage: Objected.
Listed application Id of HI-BOND is 3031560.
HI-BOND Trademark is a undefined mark.
Disclaimer: Vakilsearch assumes no responsibility or liability for any errors or omissions in the content of this page. The data is derived from mca.gov.in and ipindia.gov.in
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