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4761605

Nov 29, 2020

Bond Dex "Pasting & Corrugation Gum Powder" with Device

Bond Dex "Pasting & Corrugation Gum Powder" with Device is a DEVICE Trademark filed on Nov 29, 2020 in TAMIL NADU through India IP Office.The Trademark is registered to PRABHU G and was filed by POOJASHREE[24819].

Bond Dex "Pasting & Corrugation Gum Powder" with Device Trademark Information

Application ID

4761605

Status

Opposed

Date of Application

Nov 29, 2020

Classes

1

Proprietor(s)

PRABHU G

Attorney

POOJASHREE[24819]
F-97, 4th Floor, Anna Nagar (East), Chennai - 600102, Tamil Nadu

Type

DEVICE

Registration State

TAMIL NADU

Country

India

Published

Dec 21, 2020

Filing Mode

e-Filing

IP Office

CHENNAI

Used Since

Proposed to be used

Uploaded Documents

1

TM-A(TRADE MARKS APPLICATION)

Nov 29, 2020

2

Journal Copy

Dec 24, 2020

3

TM-O(NOTICE OF OPPOSITION)

Mar 24, 2021

4

Hearing Notice

Oct 14, 2024

5

TM-M(REQUEST SUBMITTING AUTHORISATION OF AGENT)

Nov 20, 2024

6

Order

Dec 23, 2024

7

Forwarding Letter for TM-6

Dec 26, 2024

Correspondence and Notices

1

Opposition Notice

11325185

5157782

Mar 30, 2021

2

Opposition Counter Statement

11706304

5224889

Jun 23, 2021

3

Opposition Counter Statement

19384617

7044758

Dec 26, 2024

FAQ's for Bond Dex "Pasting & Corrugation Gum Powder" with Device Trademark

The application for Bond Dex "Pasting & Corrugation Gum Powder" with Device was made on Nov 29, 2020
The trademark applicant for Bond Dex "Pasting & Corrugation Gum Powder" with Device is PRABHU G.
Trademark application has been filed under the class(es) 1.
As per IP India, trademark application is on the following stage: Opposed.
Listed application Id of Bond Dex "Pasting & Corrugation Gum Powder" with Device is 4761605.
Trademark attorney of the Bond Dex "Pasting & Corrugation Gum Powder" with Device is POOJASHREE[24819].
Bond Dex "Pasting & Corrugation Gum Powder" with Device Trademark is a DEVICE mark.
Disclaimer: Vakilsearch assumes no responsibility or liability for any errors or omissions in the content of this page. The data is derived from mca.gov.in and ipindia.gov.in
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