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3536380

Apr 19, 2016

AVOID THE VOID

AVOID THE VOID

AVOID THE VOID is a Trademark filed on Apr 19, 2016 in through IP Office.The Trademark is registered to The Indium Corporation of America and was filed by attorney.

AVOID THE VOID

AVOID THE VOID Trademark Information

Application ID

3536380

Status

Objected

Date of Application

Apr 19, 2016

Classes

6, 1, 41, 42

Proprietor(s)

The Indium Corporation of America

Details

[Class - 42]

Technical consultation in the field of developing, manufacturing and supplying nano-materials, specialty alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, electrically-conductive underfills, electrically-conductive polymers, indium-containing fabrications, and pure indium; technical consultation in the process techniques and uses of developing nano-materials, specialty alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, electrically-conductive underfills, electrically-conductive polymers, indium-containing fabrications, and pure indium.

[Class - 1]

Nano-materials, solder fluxes, electrically-conductive adhesives, electrically-conductive underfills, electrically-conductive polymers.

[Class - 41]

Educational services, namely, providing publication of on-line journals blogs on the internet and online non-downloadable publications in the nature of articles, brochures, and technical papers in the fields of solders, specialty alloys, and electrically-conductive materials; educational services, namely, live and on-line classes, seminars, conferences, meetings, workshops and informal programs using on-line activities and interactive exhibits and printable materials distributed therewith in the field of developing, manufacturing, supplying, and processing nano-materials, specialty alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, electrically-conductive underfills, electrically-conductive polymers, indium-containing fabrications, and pure indium.

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FAQ's for AVOID THE VOID Trademark

The application for AVOID THE VOID was made on Apr 19, 2016
The trademark applicant for AVOID THE VOID is The Indium Corporation of America.
Trademark application has been filed under the class(es) 6,1,41,42.
As per IP India, trademark application is on the following stage: Objected.
Listed application Id of AVOID THE VOID is 3536380.
AVOID THE VOID Trademark is a undefined mark.
Disclaimer: Vakilsearch assumes no responsibility or liability for any errors or omissions in the content of this page. The data is derived from mca.gov.in and ipindia.gov.in
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