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3536380
Apr 19, 2016
AVOID THE VOID is a Trademark filed on Apr 19, 2016 in through IP Office.The Trademark is registered to The Indium Corporation of America and was filed by attorney.
Application ID
3536380
Status
Objected
Date of Application
Apr 19, 2016
Classes
6, 1, 41, 42
Proprietor(s)
The Indium Corporation of America
Details
[Class - 42]
Technical consultation in the field of developing, manufacturing and supplying nano-materials, specialty alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, electrically-conductive underfills, electrically-conductive polymers, indium-containing fabrications, and pure indium; technical consultation in the process techniques and uses of developing nano-materials, specialty alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, electrically-conductive underfills, electrically-conductive polymers, indium-containing fabrications, and pure indium.
[Class - 1]
Nano-materials, solder fluxes, electrically-conductive adhesives, electrically-conductive underfills, electrically-conductive polymers.
[Class - 41]
Educational services, namely, providing publication of on-line journals blogs on the internet and online non-downloadable publications in the nature of articles, brochures, and technical papers in the fields of solders, specialty alloys, and electrically-conductive materials; educational services, namely, live and on-line classes, seminars, conferences, meetings, workshops and informal programs using on-line activities and interactive exhibits and printable materials distributed therewith in the field of developing, manufacturing, supplying, and processing nano-materials, specialty alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, electrically-conductive underfills, electrically-conductive polymers, indium-containing fabrications, and pure indium.